SMT Hybrid Packaging – Europe’s leading event on System Integration in Micro Electronics
SMT Hybrid Packaging: be there when the whole industry comes together. Here you can see innovative products, future trends and a wide range of service offers. Moreover you can discuss solutions regarding the challenges you are faced to – from the idea to development and production of electronic assemblies.
Experience the diversity of Assembly and Interconnection Technologies
- Technologies and Processes
- Materials and Components
- Manufacturing equipment
- Reliability and Test
- Software and Systems
- Service and Consulting
SMT Hybrid Packaging is the only event in Europe which takes a comprehensive view of System integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.
You are looking for background information about the event? You wish to know what the exhibition looks like? Here are the respective details.